| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of obtaining a multilayer circuit board which is superior in pattern adhesion. <P>SOLUTION: The method comprises a step of forming an uncured or semi-cured resin layer on an inner layer board whose outermost layer is an electric conductor circuit layer 1 by using a curing constituent containing an insulating copolymer and a curing agent (a process A), then bringing two kinds or more of organic compound selected so that the difference between the logarithm (pKa) of the reciprocal of the largest acidic dissociation constant and the logarithm (pKa) of the reciprocal of the smallest acidic dissociation constant is≥1 into contact with the surface of the resin layer (a process B), then forming an electric insulating layer (b) by curing the formed body (a process C), and forming a conductor circuit 2 on the surface of the electric insulating layer (b). <P>COPYRIGHT: (C)2004,JPO</p> |
