PACKAGING CASE, PACKAGING METHOD, AND TRANSFER METHOD FOR SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To facilitate the handling of wafers for a user to improve user's workhour (turnaround time) and prevent the breakage of the wafers upon handling them.

SOLUTION: There is provided a case for housing semiconductor wafers, one side face of which is an opening on which a lid is attached in a removable manner. On the interior wall surface of the case, a semiconductor wafer housing is formed on a prescribed part, and a plurality of steps of wafer holding parts are formed vertically at every a prescribed distance on the wafer housing, and also on the lid in the same manner. The lid is also provided with a wafer pressing member for press-fixing the semiconductor wafers and with a means for moving up and down the wafer pressing member.

COPYRIGHT: (C)2004,JPO