| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for connecting a flexible multilayer wiring board wherein interlayer connections are steadily made with high reliability. <P>SOLUTION: The flexible multilayer wiring board to be connected by this method including a flux function has a one-side outer layer wiring board wherein a supporting substrate has a wiring pattern on one of its surfaces, and has conductive two-layer posts made of copper and a metal or of copper and an alloy, protruding out of the other surface, and an inner layer wiring board wherein pads are provided on at least one of the insulating material-based one-side supporting substrate for connecting to the conductive two-layer posts, and wherein a surface covering material is provided having openings above the pads. Further, the openings are coated with a≥5μm-thick metal or alloy layer, and the inner layer wiring board is fixed by an adhesive layer having a flux function, which is placed between the conductive two-layer posts and the pads and is activated at a temperature not lower than the melting temperature point of the metal or the alloy for fulfilling its flux function. Still further, pressure is applied for the conductive two-layer posts to infiltrate into the metal or the alloy for the formation of a metallic bond. <P>COPYRIGHT: (C)2004,JPO</p> |
