SEALING MATERIAL FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To easily provide a sealing material for semiconductor device with good operability, which is superior in plasma resisting property and has excellent surface smoothness and size precision. SOLUTION: The sealing material for semiconductor device is obtained by bridging with ionizable radiation a fluororubber preform containing (a) a 100 mass pts. fluororubber component composed of a vinylidene fluoride/hexafluoropropylene elastic copolymer and/or a vinylidene fluoride/hexafluoropropylene/tetrafluoroetylene elastic copolymer, and (b)a 1 to 50 mass pts. non-elastic fluorinated carbon resin component composed of a vinylidene fluoride (co)polymer. COPYRIGHT: (C)2004,JPO