| 发明名称 |
DIE ATTACH ADHESIVE COMPOSITIONS. |
| 摘要 |
<p>A NOVEL THERMALLY REWORKABLE DIE ATTACH ADHESIVE COMPOSITION FOR ATTACHING A SEMICONDUCTOR DEVICE TO A SUBSTRATE IS PROVIDED. THE COMPOSITION COMPRISES (a) A THERMALLY REWORKABLE CROSSLINKED RESIN PRODUCED BY REACTING AT LEAST ONE DIENOPHILE HAVING A FUNCTIONALITY GREATER THAN ONE AND AT LEAST ONE 2, 5-DIALKYL SUBSTITUTED FURAN-CONTAINING POLYMER, AND (b) AT LEAST ONE THERMALLY AND/OR ELECTRICALLY CONDUCTIVE MATERIAL PRESENT IN AN EFFECTIVE AMOUNT UP TO 90BY WEIGHT OF THE DIE ATTACH COMPOSITION TO PROVIDE A CONDUCTING MEDIUM.</p> |
| 申请公布号 |
MY117024(A) |
申请公布日期 |
2004.04.30 |
| 申请号 |
MY1997PI06002 |
申请日期 |
1997.12.12 |
| 申请人 |
SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V. |
发明人 |
SHRIDHAR RATNASWAMY IYER;PUI KWAN WONG |
| 分类号 |
C09J4/00;C08G67/02;C09J9/02;H01L21/52;H01L21/58;H01L21/60;H01L23/495 |
主分类号 |
C09J4/00 |
| 代理机构 |
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代理人 |
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