| 摘要 |
A stacked microelectronic assembly comprises a continuous sheet (20) including a core panel (26) and a plurality of side panels (28, 30, 32, 34), each having a folded portion (28a', 30a', 32a', 34a') that connects the side panel to an edge of the core panel. At least two of the panels are at least partially horizontally aligned with one another in a stack. During manufacture of a stacked microelectronic assembly, failed microelectronic elements are identified and associated side panels thereof are simply cut-off. This results in the production of a usable stacked microelectronic assembly albeit of reduced capacity, or reduced functionality. |
