| 摘要 |
<P>PROBLEM TO BE SOLVED: To disassemble and reproduce a process cartridge where resin-bonding is used for the coupling system of frames. <P>SOLUTION: In a disassembling method, (1) the vicinity of a resin-bonding part is supported by a first tooling and a second tooling, and the bonding part is disassembled by separating the tooling and (2) a side cover around a melting resin inlet is circularly cut by a cutter. In a reproducing method, (1) an adhesive material is applied on a divided surface and a separated surface and (2) a first positioning/fixing member is used. <P>COPYRIGHT: (C)2004,JPO |
