| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder-resistant ink composition used for a printed-wiring board and exhibiting excellent photosensitivity, solder resistance and electrolytic corrosion resistance and insulating properties and good adhesion to a copper foil. <P>SOLUTION: This photosensitive thermosetting resin comprises a resin having a plurality of unsaturated alkylene double bonds and carboxylic acid functional groups in the molecular structure. The resin is obtained by reacting a phenol epoxy resin having a plurality of epoxy functional groups in the molecule with an unsaturated monocarboxylic acid, a polybasic acid anhydride and an epoxy group-containing unsaturated monomer. The solder-resistant ink composition comprises the photosensitive thermosetting resin, a photopolymerization initiator and a thermosetting agent. <P>COPYRIGHT: (C)2004,JPO |
