| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface inspection method and a device enabling even an unskilled person to set the optimum inspection condition simply and easily. SOLUTION: In this method and this device for inspecting the wafer surface by allowing a laser having two kinds of wavelengths to enter a wafer with a film at the same incident angle in the switching or mixing state, inspection data on the inspection device and a film parameter on the film are stored in a storage means of the inspection device in the mutually related state so as to acquire a prescribed inspection condition. An operator sets the film parameter of the wafer to be measured by a setting means of the inspection device in each measurement. Thus, a desired inspection condition is set automatically in the inspection device. The film parameter set by the operator in each measurement is a film thickness or a refractive index of the film. COPYRIGHT: (C)2004,JPO
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