| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal base circuit board having superior reliability with high productivity, reducing losses during the circuit formation. SOLUTION: The method for manufacturing a metal base circuit board sequentially comprises: a step (1) for applying an insulating adhesive composition (a) on a metal foil (A) to be fed continuously, laminating a metal foil (B) to be fed continuously on a layer comprising the insulating adhesive composition (a), pressuring the metal foil (A), the insulating adhesive composition (a), and the metal foil (B) by a roll so as to bond together, and curing the insulating adhesive composition; and a step (2) for continuously or intermittently forming a circuit by the metal foil (A) and/or the metal foil (B) of the metal foil composite; a step (3) for integrating the metal foil composite formed circuit on a metal plate via an insulating material sheet or a conductive material sheet, and curing the insulating material sheet or the conductive material sheet so as to integrate. COPYRIGHT: (C)2004,JPO
|
