| 摘要 |
PROBLEM TO BE SOLVED: To obtain a printed wiring board which solves a connecting failure of a solder ball due to electroless nickel plating and which has high connecting reliable strength to the solder ball without embrittling a solder bump due to a cold. SOLUTION: Connecting terminals 106, 107 made of patterned copper foils 103, 105 are formed on both surfaces of an insulating board 102, and the terminals of both the surfaces are electrically connected by a conductor layer 108 passing through the insulating board. Electroless nickel plating/electroless flash gold plating two layers 602 are formed on the foil 103 of the terminal 106, and electrolytic nickel plating/electrolytic nickel plating two layers 403 are formed on the foil 105 of the terminal 107. COPYRIGHT: (C)2004,JPO
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