发明名称 |
COOLING APPARATUS FOR MODULE RAM HANDLER |
摘要 |
PURPOSE: A cooling apparatus for a module RAM handler is provided to compensate heat generation efficiently as to a module RAM using a prolonged nozzle and a plurality of sensors. CONSTITUTION: According to the cooling apparatus for a module RAM handler, a nozzle tank(220) is installed between guide frames and has a plurality of prolonged nozzles(230). A temperature sensing sensor(240) is installed on a part of the nozzles, and controls an air temperature. A sensor(250) for sensing temperature of a module RAM is installed on the module RAM and senses the temperature of the module RAM. A temperature controller(330) is connected to the air temperature sensing sensor and the module RAM temperature sensing sensor. A control valve(340) is connected to the temperature controller. And a heat exchanger(350) is connected to the control valve and is connected to the nozzle tank. |
申请公布号 |
KR20040036177(A) |
申请公布日期 |
2004.04.30 |
申请号 |
KR20020064998 |
申请日期 |
2002.10.23 |
申请人 |
MIRAE CORPORATION |
发明人 |
CHOI, YEONG MI;HWANG, HYEON JU;LEE, BYEONG GI;PARK, CHAN HO |
分类号 |
G01R31/26;H01L21/66;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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