发明名称 COOLING APPARATUS FOR MODULE RAM HANDLER
摘要 PURPOSE: A cooling apparatus for a module RAM handler is provided to compensate heat generation efficiently as to a module RAM using a prolonged nozzle and a plurality of sensors. CONSTITUTION: According to the cooling apparatus for a module RAM handler, a nozzle tank(220) is installed between guide frames and has a plurality of prolonged nozzles(230). A temperature sensing sensor(240) is installed on a part of the nozzles, and controls an air temperature. A sensor(250) for sensing temperature of a module RAM is installed on the module RAM and senses the temperature of the module RAM. A temperature controller(330) is connected to the air temperature sensing sensor and the module RAM temperature sensing sensor. A control valve(340) is connected to the temperature controller. And a heat exchanger(350) is connected to the control valve and is connected to the nozzle tank.
申请公布号 KR20040036177(A) 申请公布日期 2004.04.30
申请号 KR20020064998 申请日期 2002.10.23
申请人 MIRAE CORPORATION 发明人 CHOI, YEONG MI;HWANG, HYEON JU;LEE, BYEONG GI;PARK, CHAN HO
分类号 G01R31/26;H01L21/66;(IPC1-7):G01R31/26 主分类号 G01R31/26
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