SEMICONDUCTOR WAFER HOLDING FIXTURE AND MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To hold a semiconductor wafer to form a metal electrode film of an insulated gate bipolar transistor on a rear surface of a semiconductor wafer after grinding the rear surface, without applying a stress in the horizontal direction to the semiconductor wafer. SOLUTION: This fixture is provided with a fixture main body 31 contact to or facing a surface of the semiconductor wafer 1; and a supporting body 32 which supports a peripheral part of a semiconductor wafer 1 from a rear surface side of the semiconductor wafer, under the condition where almost the entire surface of the rear surface of the semiconductor wafer 1 is exposed. Under the condition where the surface of the semiconductor wafer 1 is brought into contact with or made to face to the fixture main body 31, the semiconductor wafer 1 is held between the fixture main body 31 and a flange 34 of the supporting body 32 so as to clip the peripheral part of the semiconductor wafer 1. COPYRIGHT: (C)2004,JPO