| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for manufacturing a leadless surface mount resin package IC. SOLUTION: After an adhesive tape 13 is bonded to the lower surface of a conductive substrate 11, the conductive substrate 11 is patterned to prepare a multi-terminal group frame 14 where a plurality of terminal groups 16, each having a chip mount part 17 and a plurality of terminals 18, are arranged in a frame 15. A chip 1 is bonded to the chip mount part 17 of each terminal group 16 and a wire 5 is bonded between the electrode pad 3 of the chip 1 and the terminal 18. The internal space of the frame 15 on the adhesive tape 13 is filled with sealing resin to mold a resin sealed body 21. The adhesive tape 13 is then stripped off from the resin sealed body 21 to expose the chip mount part 17 and the terminal 18. Subsequently, the resin sealed body 21 is cut into individual pieces. Since etching can be eliminated, the required man-hours can be reduced. Since the force to strip the adhesive tape is small, the terminal can be prevented from being stripped from the resin sealed body by the adhesive tape. COPYRIGHT: (C)2004,JPO |
