PACKAGE FOR HOUSING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To extend a flat part of an I/O terminal in an inside direction of a package for housing a semiconductor element and to eliminate a repeating substrate by effectively preventing a connecting failure to a frame of the I/O terminal or connecting failure of wire bonding due to warpage of the flat plate. SOLUTION: The I/O terminal 3 inserted into a mounting part 2a of the frame 2 is set three times as long as a site 3ab of an outside of the frame 2 in length of a site 3aa of the inside of the frame 2 in a direction parallel to a line conductor 3a-A of the flat plate 3a. An extended part 5 extended to the inside of the frame 2 is formed so as not to arrive at the conductor 3a at both ends A of a standing wall 3b. COPYRIGHT: (C)2004,JPO