| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which simplifies a mold structure for case molding, dispenses with processes given to an electrode surface, and eliminates air accumulation causing bubbling. SOLUTION: An electrode (2) is disposed in a case (1) so as to pass therethrough with an inner lead (2b) positioned at the inner side of the case (1). When embedding the inner lead (2b) with a fixing bed (7), the wire bonding surface (2c) of the inner lead (2b) and the upper surface of the fixing bed (7) are positioned at the same level so as to expose the wire bonding surface (2c). The end face (2e) of the inner lead (2b) is withdrawn from the end face (7e) of the fixing bed (7), and a notch (7a) is formed in the fixing bed (7), allowing a portion of the end face (2e) to be exposed. This notch (7a) is a trace of a portion of a mold involved in molding the case (1). COPYRIGHT: (C)2004,JPO |
