| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board manufacturing method using divided exposure which is capable of increasing the effective pieces in number in a method of manufacturing the multilayer printed wiring board through a divided projection aligner. <P>SOLUTION: In the multilayer printed wiring board manufacturing method through which the pieces 11 are projected onto a substrate by a divided projection aligner, the pieces 11 are arranged on the substrate through a divided projection aligner as an original mask 1 where alignment marks 4 are arranged in a blank space. By this manufacturing method, the pieces 11 obtained on the substrate are increased in number, and the multilayer printed wiring board can be improved in productivity and reduced in cost. <P>COPYRIGHT: (C)2004,JPO</p> |
