| 摘要 |
<p>PURPOSE: A semiconductor package for tab bonding is provided to perform easily a tab bonding process and restrict the generation of short circuit between a wire and a semiconductor chip by reducing a stepped portion between a semiconductor chip and a lead frame pad. CONSTITUTION: A semiconductor package for tab bonding includes a lead frame pad(302), a semiconductor chip(310), a plurality of signal leads(306), a ground lead, a first wire(314), a second wire(316), and a molding material(318). The lead frame pad(302) includes a depressed portion and a wall projected from an edge around the depressed portion. The semiconductor chip(310) is adhered on the depressed portion by using a bonding agent. The signal leads are arranged on both sides of the lead frame pad. The ground lead is arranged between the signal leads. The ground lead is connected to the lead frame pad. The first wire(314) is used for connecting electrically the semiconductor chip to the signal leads. The second wire(316) is used for connecting electrically the semiconductor chip to the ground lead. The molding material(318) is used for covering the lead frame pad, the semiconductor chip, the signal leads, the first wire, and the second wire except for a bottom face of the lead frame pad, the signal leads, and a part of the ground lead.</p> |
