发明名称 METHOD OF FORMING FINE-PATTERN USING HYDROPHILIC SOLVENT
摘要 PURPOSE: A method of forming a fine-pattern is provided to improve the step coverage and uniformity of a coating material and to reduce a usable amount of the coating material by using a hydrophilic solvent. CONSTITUTION: Hydrophilic processing is performed on a substrate with a photoresist pattern by using a hydrophilic solvent. A coating material is coated on the substrate. The coating material is thermally shrunk from a heat treatment. At this time, the thermally shrunk coating material obtains an improved CD(Critical Dimension) for the photoresist pattern. The coating material is substantially removed therefrom.
申请公布号 KR20040036588(A) 申请公布日期 2004.04.30
申请号 KR20030073768 申请日期 2003.10.22
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 SUGETA YOSHIKI;KANEKO FUMITAKE;TACHIKAWA TOSHIKAZU
分类号 G03F7/40;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/40
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