| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a copper paste capable of reducing protrusions of a via conductor generated at baking, enabling to apply a plating process on a surface of the via conductor without glass floating for a printed board using copper for the via conductor, and to provide the wiring board using the same. <P>SOLUTION: The copper paste is composed of a copper powder, an organic vehicle, and a ceramic grain with the grain size of 100nm or less. The content of the organic vehicle is 6 mass part against 100 mass part of the copper powder. The copper paste is filled in through holes formed on a plurality of ceramic green sheets and baked to obtain a wiring board having via conductors connecting a plurality of conductor layers through a plurality of ceramic layers. <P>COPYRIGHT: (C)2004,JPO</p> |
