| 摘要 |
<P>PROBLEM TO BE SOLVED: To minimize the damage to a metallic vessel for a dielectric plate supporting unit and improve the plasma processing efficiency. <P>SOLUTION: In the plasma processing apparatus, a resin layer is arranged in an opposing region between the dielectric plate and the processing vessel. According to this method, particle damage generated by the difference of the expansion coefficients between the dielectric plate and the metallic processing vessel is absorbed. On the other hand, the generation of local discharge in the boundary of an electric field such as the edge of the dielectric plate or the like is suppressed whereby the efficiency of plasma processing such as the deposit of an oxide film or the like can be improved. <P>COPYRIGHT: (C)2004,JPO |
