发明名称 CERAMIC CAPACITOR BAKED AT SAME TIME, AND METHOD FOR FORMING CERAMIC CAPACITOR TO USE IN PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a capacitor structure and a manufacturing method thereof, which improve a crack caused from the difference of coefficients of thermal expansion (TCE) between an electrode and a dielectric, and are capable of constructing a multilayer structure due to the strong connection between the electrode and dielectric, and forming the electrode with copper. SOLUTION: The capacitor structure is fabricated by forming the pattern of a first dielectric on a metallic foil, and a first electrode on the first dielectric to bake the first dielectric and first electrode at a same time. The dielectric and first electrode baked at the same time improve the crack caused form the difference of the coefficients of thermal expansion (TCE) between the electrode and dielectric. The baking at the same time makes the strong connection between the electrode and dielectric surely. Further, the multilayer capacitor structure with a capacitor electrode that is formed with the copper by the baking at the same time, is constructed. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004134806(A) 申请公布日期 2004.04.30
申请号 JP20030354152 申请日期 2003.10.14
申请人 E I DU PONT DE NEMOURS & CO 发明人 BORLAND WILLIAM J
分类号 H01G4/01;H01G4/12;H01G13/00;H05K1/09;H05K1/16;H05K3/20;H05K3/42;H05K3/46;(IPC1-7):H01G13/00 主分类号 H01G4/01
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