| 摘要 |
PROBLEM TO BE SOLVED: To provide a robot for transferring substrates in a processing system with the thermal influence set to a minimum level. SOLUTION: The robot 108 for transferring a substrate 112 in a processing system 100 consists of a body, a link, and an end effector. The end effector is adapted to keep the substrate at the upper portion. The end effector or the link comprises a material, having a coefficient of thermal expansion of less than about 5×10<SP>-6</SP>K<SP>-1</SP>. The end effector or the link comprises a material having the ratio for the coefficient of thermal conductivity to the coefficient of thermal expansion to exceed about 10W/(m×K<SP>2</SP>). COPYRIGHT: (C)2004,JPO |
