| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing object and apparatus for flattening the surface of a substrate. SOLUTION: The manufacturing object is provided for polishing a substrate 114, and comprises a polishing object 205 having a main body. The main body is covered with at least a conductive material, a conductive filler, and the combination of the conductive material with the conductive filler; and has a portion of a fiber adapted to the polishing of the substrate. The polishing object comprises the main body having its surface adapted to the polishing of the substrate and one or more conductive elements 840 embedded in a polishing surface 448 each of which has an insulating or conductive fiber covered with a conductive material, a conductive filler, or the combination of the conductive material with the conductive filler. The conductive element may have a contact surface extended over the plane defined by the polishing surface. A plurality of bored holes 546 and a plurality of grooves 442 are formed in the polishing object, and these may facilitate the flows of the material passed through the polishing object and the material surrounding the polishing object. COPYRIGHT: (C)2004,JPO
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