| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultra-fine flexible film circuit board, a high-accuracy method for mounting electronic components to the circuit board, and to provide a method for manufacturing the ultra-fine flexible film circuit board at high productivity. SOLUTION: In the method for manufacturing an electronic component mounting circuit board, a flexible film is stuck to a first reinforcing plate via a strippable organic substance layer; and next, after a circuit pattern is formed on the flexible film, the flexible film with the circuit pattern is transferred to a second reinforcing plate, so that the electronic components are mounted on the circuit pattern. COPYRIGHT: (C)2004,JPO |
