| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor element with bumps in which a positioning step is eliminated when a solder material is printed on a board in a process for mounting the semiconductor element with bumps, e.g. a BGA or a CSP, on an FPC board, or the like, by solder reflow while suppressing positional shift of the semiconductor element with bumps and failure of mounting, and to provide a mounting structure of the semiconductor element with bumps, an electro-optical device employing it, and an electronic apparatus. SOLUTION: The mounting method of a semiconductor element with bumps, e.g. a BGA or a CSP, comprises steps (A) for applying a solder material to the bumps of the semiconductor element with bumps, and (B) for mounting the semiconductor element with bumps applied with the solder material on the board by reflow. COPYRIGHT: (C)2004,JPO
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