| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in a lift-off process following to the deposition of a gate metal layer having a thickness of 6,000Åor above that a gate electrode and the gate metal layer on a resist are not cut after lift-off because a narrow gap into which resist removing liquid enters has a long length. SOLUTION: The thickness of the gate metal layer is set at 3,000Åor less. Consequently, resist removing liquid permeates easily and lift-off is facilitated. Since the joint of the gate metal layer and the gate electrode is not required to be torn off by a strong ultrasonic wave, the production of burrs can be prevented. COPYRIGHT: (C)2004,JPO
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