| 摘要 |
PROBLEM TO BE SOLVED: To realize a deposition system having a stable deposition rate by suppressing the solidification of a deposition material. SOLUTION: The deposition system is provided with a crucible 2 arranged within a vacuum vessel 1, a cooling section 2 for suppressing the temperature rise of the crucible 2, and an electron gun 4 for irradiating the crucible 2 with electron beams. Also, holder mechanism 5 and 6 for holding a material to be coated are arranged in the vacuum vessel 1 and an ion supply source 7 and a neutralizer 8 are disposed in the positions where the material to be coated can be irradiated with prescribed particles. An openable and closable shutter 9 are disposed between the holder mechanisms 5 and 6, and the crucible 2 and is connected to a shutter opening and closing control section 10. Further, the electron gun 4 is connected to a vapor deposition rate control section 11 for controlling the vapor deposition rate to a prescribed range. Also, the system has an ion supply source 12 for irradiating the material for vapor deposition held at the crucible 2 with cation in vapor deposition operation. COPYRIGHT: (C)2004,JPO
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