METALLIC PARTICULATE AND ADHESIVE, FILM AND ELECTRIC CIRCUIT SUBSTRATE USING THE PARTICULATE

摘要

PROBLEM TO BE SOLVED: To provide conductive particulates having excellent cost effectiveness and high reliability even to connection of multicontact electrodes, etc., of a fine pitch, an anisotropic-conductive adhesive, an anisotropic-conductive film, and an electric circuit substrate of high reliability. SOLUTION: The metallic particulates internally have cavities and have an average particle size ranging from 5 nm to 12μm and an average thickness of shells ranging from 1 nm to 2μm. The metallic particulates consist of one or≥2 metals selected from metals having a standard electrode potential≥0.85 mV or an alloy containing one or more metals selected from metals having a standard electrode potential≥0.85 mV in these metals. The metallic particulates further include the second metallic particulates in the cavities. The anisotropic-conductive particulates are provided with insulative thermoplastic resin layers on the surfaces of the above described metallic particulates. COPYRIGHT: (C)2004,JPO