发明名称 APPARATUS AND METHOD FOR MONITORING PLATEN TILT POSITION IN SEMICONDUCTOR FABRICATION PROCESS
摘要 PURPOSE: An apparatus and a method for monitoring the tilt position of a platen in a semiconductor fabrication process are provided to monitor accurately the tilt position of the platen by using a plurality of optical sensors to measure a position of the platen. CONSTITUTION: An apparatus for monitoring a tilt position of a platen in a semiconductor fabrication process includes a platen(122), a holding unit(120), an optical sensor unit(150), and a control unit(140). A wafer is loaded on the platen(122) within a process chamber. The holding unit(120) includes a first rotation unit and a second rotation unit to shift the platen to an X-axis and a Y-axis or rotate the platen. The optical sensor unit(150) is installed within the process chamber in order to transmit and receive an optical signal for measuring distance from the wafer according to a tilt position of the platen. The control unit(140) decides the tilt position of the platen and controls the holding unit.
申请公布号 KR20040036017(A) 申请公布日期 2004.04.30
申请号 KR20020064769 申请日期 2002.10.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOON, YEONG HA
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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