| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a SAW device of a structure, wherein a SAW (surface acoustic wave) chip is mounted on a wiring substrate via conductor bumps disposed therebetween, which can ensure a coupling strength between the substrate and the chip, while avoiding infiltration of air into a surface which an adhesive resin film comes into contact and eliminating the need for a large-scale facility such as a vacuum tank, when application of an adhesive resin film to the outer surface of the chip and formation of an airtight space between the bottom of the chip and the upper surface of the substrate are carried out. <P>SOLUTION: The SAW device includes the board 2, the SAW chip 15, and the film 20 provided between the lower surface of the chip and the upper surface of the substrate to define an airtight space S for combining the substrate and the chip into a single unit. The film adheres tightly to the entire outer surface of the chip, other than its lower surface and covers this surface. The outer peripheral edge of the film has a plate shape having a surface area as to reach the upper surface of the substrate. The film is heated and softened to adhere tightly to the entire outer surface of the chip other than the lower surface of the chip and on the upper surface of the substrate, to thereby define the airtight space between the lower surface of the chip and the upper surface of the substrate. <P>COPYRIGHT: (C)2004,JPO</p> |
