| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board with terminal of large conduction capacity with few cracks of the board, superior in reliability and durability, simple in assembly process of a semiconductor module with high output and high capacity and suitable as a circuit board for a large power device. <P>SOLUTION: Metallic circuit boards 3 and 4 are bonded to at least one face of a ceramic board 12 which is mainly composed of silicon nitride ceramics, and an outer terminal 17 is integrally bonded to a surface of the metallic circuit board 3 by brazing, thereby completing a circuit board 11 with terminals. Thickness of a bonding part of the outer terminal 17 bonded by brazing is not less than 3mm. <P>COPYRIGHT: (C)2004,JPO</p> |
