| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier for tape automated bonding which can realize high density wirings with reduction of a weight and a thickness while a dimensional accuracy and a positional accuracy are improved at a conveying time, mounting time and bonding time. SOLUTION: A conductor pattern 7 set at a pitch IP of respective inner leads 9 to 60μm or less is formed on a front surface of an insulating layer 2 of the tape carrier 1 for the tape automated bonding, and a reinforcing layer 4 made of a stainless steel foil is formed along a longitudinal direction at both lateral side edges of the layer 2 on its rear surface. Thus, the dimensional accuracy and the positional accuracy at the conveying time, mounting time and bonding time are improved while the layer 2 is formed thinly, and an electric part can be surely mounted in a high density wiring in which a pitch of inner leads 9 in the pattern 7 becomes 60μm or less with the reduction of the weight and the thickness. COPYRIGHT: (C)2004,JPO |
