| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP pad conditioner which keeps cutting performance while keeping abrasive grain retention force. <P>SOLUTION: On a base metal 14 of the CPM pad conditioner 10, a step 15 is disposed on a surface acting on the CPM pad to form upper stage sections 11 and a lower stage section 12. Abrasive grain layers are formed on both the upper stage sections 11 and the lower stage section 12, and the tip heights of the abrasive grains 13 are different from each other. Dimension of the step of the base metal is preferably 10-30 % of a mean particle diameter of super abrasive grains. The area of the abrasive grain layer formed on the upper stage sections is preferably 1/3 to 2/3 of total area of the abrasive grain layers. <P>COPYRIGHT: (C)2004,JPO |
