发明名称 |
Flip-chip system and method of making same |
摘要 |
A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture.
|
申请公布号 |
US2004082107(A1) |
申请公布日期 |
2004.04.29 |
申请号 |
US20020281844 |
申请日期 |
2002.10.28 |
申请人 |
INTEL CORPORATION |
发明人 |
SHI SONG-HUA;CHEN TIAN-AN |
分类号 |
C08L63/00;C08L65/00;H01L21/56;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
C08L63/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|