Device inspecting for defect on semiconductor wafer surface

摘要

An inspection device inspecting for a defect based on an image of wafer surface includes an imaging device obtaining an image data of a wafer subjected to inspection, a storage circuit storing an image data of a wafer for comparison reference, an image comparison unit comparing the image data of the wafer subjected to inspection and the image data of the wafer for comparison reference using a pre-set inspection condition, an acquiring circuit acquiring the WIP data of the wafer subjected to inspection, and a WIP data operating unit setting the inspection condition based on the obtained WIP data.