| 发明名称 |
Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method |
| 摘要 |
A circumferential portion of a land portion 14 which is formed on a surface of the printed wiring board for mounting a component with a lead-free solder is covered with an extending portion 21 of a solder mask 20 formed on the surface of the printed wiring board.
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| 申请公布号 |
US2004078964(A1) |
申请公布日期 |
2004.04.29 |
| 申请号 |
US20030471075 |
申请日期 |
2003.09.05 |
| 申请人 |
ITOU KAZUHIRO;NAGATA MAMORU;KAYABA MASAO;MIYAKE YOSHIHIKO;ARAKANE HIDEYUKI |
发明人 |
ITOU KAZUHIRO;NAGATA MAMORU;KAYABA MASAO;MIYAKE YOSHIHIKO;ARAKANE HIDEYUKI |
| 分类号 |
H05K3/34;(IPC1-7):H05K1/16;H05K1/00 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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