APPARATUS FOR MANUFACTURING SEMICONDUCTOR

摘要

PURPOSE: An apparatus for manufacturing semiconductor is provided to etch easily and rapidly only an edge of a wafer by using a gas injection nozzle for injecting nitrogen gas to prevent the flow of chemicals to a wafer shielding side. CONSTITUTION: An apparatus for manufacturing semiconductor includes a supporter portion(100), a nozzle portion, and a shielding cover(400). A semiconductor substrate is loaded on the support portion(100). The nozzle portion injects fluid onto an edge part of the semiconductor substrate loaded on the supporter portion(100). The shielding cover(400) is used for preventing the flow of the fluid injected from the nozzle portion to a wafer shielding side. The shielding cover includes a gas injection unit for injecting gas in order to prevent the flow of the fluid to the wafer shielding side.