| 摘要 |
PURPOSE: A pumping/purging method of a load lock chamber for fabricating a semiconductor device is provided to prevent particles and contamination within the load lock chamber by controlling a supply process of vacuum pressure and a supply process of purge gas. CONSTITUTION: A semiconductor fabrication system includes a load lock chamber for forming airtight atmosphere, a vacuum pump for providing vacuum pressure, a gas supply unit for providing purge gas, a control valve for controlling the supply of the vacuum pressure and the supply of the purge gas, and a control unit for controlling operations of the vacuum pump, the gas supply unit, and the control valve. The vacuum pressure and the purge gas are provided at a time point to change the internal pressure of the load lock chamber(ST200-ST214). One process of the vacuum pressure supply process and the purge gas supply process is interrupted step by step(ST216-ST224). |
