发明名称 |
Method of forming a sputtering target assembly and assembly made therefrom |
摘要 |
A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.
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申请公布号 |
US2004079634(A1) |
申请公布日期 |
2004.04.29 |
申请号 |
US20030689771 |
申请日期 |
2003.10.21 |
申请人 |
WICKERSHAM CHARLES E.;WORKMAN DAVID P. |
发明人 |
WICKERSHAM CHARLES E.;WORKMAN DAVID P. |
分类号 |
B21K25/00;B23K1/00;C23C14/34;(IPC1-7):C23C14/35;B23K9/235 |
主分类号 |
B21K25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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