发明名称 |
Gedruckte Leiterplatte und elektronische Bauteile |
摘要 |
<p>A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material. <IMAGE></p> |
申请公布号 |
DE69725689(T2) |
申请公布日期 |
2004.04.29 |
申请号 |
DE1997625689T |
申请日期 |
1997.12.23 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TSUKAMOTO, MASAHIDE |
分类号 |
H05K3/20;H01L21/60;H01L23/12;H01L23/31;H01L23/498;H05K1/11;H05K1/18;H05K3/00;H05K3/28;H05K3/40;H05K3/46;(IPC1-7):H05K3/40 |
主分类号 |
H05K3/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|