WAFER TRANSFER CHUCK HAVING ELECTRIC WIRE AND SEMICONDUCTOR FABRICATION EQUIPMENT HAVING THE SAME

摘要

PURPOSE: A wafer transfer chuck having an electronic wire and semiconductor fabrication equipment having the same are provided to prevent an over-etching phenomenon of a wafer by sensing and exchanging a broken wafer transfer chuck. CONSTITUTION: A wafer transfer chuck having an electronic wire includes a couple of vertical fixing plates(108), a horizontal fixing plate(111), and a wafer fixing plate(105). The horizontal fixing plate is used for connecting a top part of one vertical fixing plate(108) to a top part of the other vertical fixing plate. The wafer fixing plate(105) is used for fixing each bottom part of the vertical fixing plates(108). A plurality of grooves(109) are formed on the wafer fixing plate(105) in order to support a wafer(102). An electric wire is formed in the inside of the wafer fixing plate and the inside of the vertical fixing plates.