发明名称 |
Conductive polishing article for electrochemical mechanical polishing |
摘要 |
Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.
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申请公布号 |
US2004082289(A1) |
申请公布日期 |
2004.04.29 |
申请号 |
US20030642128 |
申请日期 |
2003.08.15 |
申请人 |
BUTTERFIELD PAUL D.;CHEN LIANG-YUH;HU YONGQI;MANENS ANTOINE P.;MAVLIEV RASHID;TSAI STAN D.;LIU FENG Q.;WADENSWEILER RALPH;SUN LIZHONG;NEO SIEW S.;DUBOUST ALAIN |
发明人 |
BUTTERFIELD PAUL D.;CHEN LIANG-YUH;HU YONGQI;MANENS ANTOINE P.;MAVLIEV RASHID;TSAI STAN D.;LIU FENG Q.;WADENSWEILER RALPH;SUN LIZHONG;NEO SIEW S.;DUBOUST ALAIN |
分类号 |
B23H5/00;B23H5/06;B23H5/08;B23H5/10;B24B37/04;B24B49/16;B24B53/007;B24D13/14;C25D17/00;C25D17/10;H01L21/321;(IPC1-7):B24D11/00 |
主分类号 |
B23H5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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