发明名称 |
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT FABRICATING METHOD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FABRICATING METHOD |
摘要 |
A method of forming a bump electrode (300) on an electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving up a bonding capillary, moving the bonding capillary sideway and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The bump electrode (300) has a particular form, with a bump portion (40) having a vertex (7) at a first height above the electrode and a tail portion (50) extending from the bump portion (300) and having a vertex (52) at approximately the same height as the vertex of the bump portion (40). Both vertices have a flattened surface (31a). <IMAGE> |
申请公布号 |
SG103272(A1) |
申请公布日期 |
2004.04.29 |
申请号 |
SG20000007371 |
申请日期 |
1997.10.01 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KAZUSHI HIGASHI;NORIHITO TSUKAHARA;TAKAHIRO YANEZAWA;YOSHIHIKO YAGI;YOSHIFUMI KITAYAMA;HIROYUKI OTANI |
分类号 |
H01L21/60;H01L23/485 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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