发明名称 Ohmic contact configuration
摘要 A contact configuration has an ohmic contact between a metalization layer and a semiconductor body of monocrystalline semiconductor material. An amorphous semiconductor layer is formed between the metalization layer and the monocrystalline semiconductor body. The layer is formed of the same semiconductor material as the body. The contact configuration is either produced by applying amorphous semiconductor material on the semiconductor body (e.g., sputtering, vapor deposition, glow discharge) or by damage formation in the semiconductor body.
申请公布号 US2004080015(A1) 申请公布日期 2004.04.29
申请号 US20030686849 申请日期 2003.10.16
申请人 MAUDER ANTON;SCHULZE HANS-JOACHIM;STRACK HELMUT 发明人 MAUDER ANTON;SCHULZE HANS-JOACHIM;STRACK HELMUT
分类号 H01L29/24;H01L29/26;H01L29/417;H01L29/45;H01L29/739;H01L29/78;(IPC1-7):H01L29/00 主分类号 H01L29/24
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