| 摘要 |
Disclosed herein is a pressure sensitive adhesive sheet for fixing a semiconductor wafer in semiconductor wafer processing in vacuum, comprising a substrate and, superimposed on one side or both sides thereof, a layer of ultraviolet curable pressure sensitive adhesive composition comprising an ultraviolet curable copolymer having ultraviolet polymerizable groups as side chains and a phosphorus photopolymerization initiator. The invention is intended to provide a pressure sensitive adhesive sheet for semiconductor wafer processing which, even in the processing of a semiconductor wafer in vacuum, is free from generating gases from the pressure sensitive adhesive sheet to thereby enable avoiding wafer deformation attributed to evaporated gas components and adhesive transfer caused thereby. |
