发明名称 |
Method for removing particles from a semiconductor processing tool |
摘要 |
A method for removing particles from a semiconductor processing tool is provided. The method comprises providing a pick-up wafer for picking up particles from a semiconductor processing tool, inserting said pick-up wafer into said semiconductor processing tool and placing the pick-up wafer on a receiving member, applying an electrostatic charge to said pick-up wafer, leaving said pick-up wafer in said semiconductor processing tool for a predetermined dwell time; and removing said pick-up wafer from said semiconductor processing tool. Further, a method for processing semiconductor wafers is provided.
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申请公布号 |
US2004079385(A1) |
申请公布日期 |
2004.04.29 |
申请号 |
US20020280629 |
申请日期 |
2002.10.25 |
申请人 |
FRISA LARRY E.;KELLOGG SCOTT S.;MCEWAN GRANT W.;MONTGOMERY MICHAEL N.;SHAHVANDI IRAJ ERIC |
发明人 |
FRISA LARRY E.;KELLOGG SCOTT S.;MCEWAN GRANT W.;MONTGOMERY MICHAEL N.;SHAHVANDI IRAJ ERIC |
分类号 |
B08B7/00;C23C16/44;(IPC1-7):B08B3/12 |
主分类号 |
B08B7/00 |
代理机构 |
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