| 摘要 |
The influence of high-frequency noise produced from the active surfaces of ICs is suppressed and the sensitivity of a communication device is improved by appropriately arranging the ICs which are noise sources. A high-frequency analog IC (91A) and a digital IC (92A) for processing signals, both of which generate high-frequency noise, are mounted on the back (712) of a circuit board (71) with the faces of the ICs down. Namely, the active surfaces (910A and 920A) of the ICs (91A and 92A) do not face to a loop antenna (4) provided integrally with an arm band on the back side of the circuit board (71), but to a liquid crystal panel provided on the front side of the main body of the communication device. Therefore, even when high-frequency noise is produced from the active surfaces of the ICs (91A and 92A), the actitivity of the communication device is high because noise hardly reaches the loop antenna (4). <IMAGE> |
