| 摘要 |
In order to provide an improved heat transfer interface between an solid state device and a heat sink to which it is soldered, one or more "vents" are provided in the interface between the solid state device and the heat sink to prevent the entrapment of gases that could form solder voids. Advantageously, the provision of such vents in the interface surface geometry of the semiconductor may be effected by the use of appropriate masking and etching following the epitaxial regrowth process. Alternatively, the heat sink or a solder preform may be provided with suitable notches. The use of such "die-bond vents" also allows solder, after melting, to be forced under the chip by external gas pressure such that no solder voids are left.
|
