发明名称 |
Method for aligning and exposing a semiconductor wafer |
摘要 |
Exposure positions of exposure fields of semiconductor wafers are subsequently corrected individually in order to compensate for processes affecting the locational position of alignment marks and/or oblique measurement structures. Measurement structures are formed preferably in the frame region of product wafers comprising electrical circuits to be formed and their locational positions before and after the effect of the process that has an effect are compared individually for purpose of determining the positional displacement for each relevant exposure field. From this there is determined either directly a "shot"-fine correction value for the individual exposure or at least one nonlinear function for the correction in dependence on the position of the measurement structures on the wafer. The corrections are applied to the exposure fields after alignment to the alignment marks overformed by the process in dependence on their position on the wafer.
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申请公布号 |
US2004082085(A1) |
申请公布日期 |
2004.04.29 |
申请号 |
US20030686848 |
申请日期 |
2003.10.16 |
申请人 |
ROSSIGER MARTIN;SCHEDEL THORSTEN;STACKER JENS |
发明人 |
ROSSIGER MARTIN;SCHEDEL THORSTEN;STACKER JENS |
分类号 |
H01L23/544;(IPC1-7):H01L21/66 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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地址 |
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